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Contract Diamond Wire Slicing |
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Wafering |
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| Wafering |
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| Our process delivers consistent results in terms of TTV, wafer flatness, surface roughness and kerf loss. Parts are returned free of any processing fluid and packaged as requested. We offer short lead times and have many sizes of wire guide pitch in stock from .509mm to 12.10mm to turn your parts around quickly. |
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